We provide a process mechanics model based on first principles molecular dynamics, interface fracture mechanics, and damage mechanics. This model incorporates non-linear, integrated-local, thermo-hydro-mechanical-electro-magnetic-optical multi-field and multi-scale coupling. It quantitatively analyzes the influence mechanisms of materials, structures, and process factors on mechanical behavior in the manufacturing process. It also explores the interconnections between various manufacturing processes to optimize process parameters and conduct reliability verification analysis for relevant processes. We developing computer-aided processing and reliability (CAPR) software, focusing on semiconductor chip manufacturing processes and reliability simulation models. The software includes a semiconductor material database embedded with constitutive relationships, enabling targeted chip manufacturing and packaging process modeling.